LED full color advertising screen packaging technology and structural design
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With the continuous updating and advancement of LED advertising screen chip performance, lighting color, external dimensions and installation methods, as well as the increasing demand for applications, LED packaging technology is constantly being introduced.
The so-called package is to pack the LED advertising screen chip with insulating plastic or ceramic material to isolate the chip from the outside to prevent the impurities in the air from corroding the chip circuit and causing the electrical performance to drop. The packaged chip is easier to install and transport. Packaging technology is very important, because only packaged products can become end products, which can be used by users, and the quality of packaging technology directly affects the performance of the product itself. The reliable packaging technology is the product to be practical and market-oriented. The only way to go.
Since the 1990s, LED chip and material fabrication technology has made many breakthroughs in research and development, transparent substrate trapezoidal structure, textured surface structure, chip flip structure and commercial ultra-high brightness (above 1cd) red, orange and yellow. , green, blue LED products have been asked about the market. In recent years, the upper and middle reaches of LED industry have received unprecedented attention, further promoting the development of downstream packaging technology and industry. With a variety of package structure and size, different luminescent color of the die and its two-color or three-color combination, a variety of series, varieties, specifications of products can be produced.
A single die generally constitutes a point source, and a plurality of die assemblies generally constitute a surface source and a line source for information, status indication, and display. The illuminating display is also formed by combining a plurality of dies, through appropriate connections of the dies (including series and parallel), with suitable optical structures to form the illuminating segments and illuminating points of the illuminating display. Surface mount LEDs can gradually replace pin-type LEDs, and the application design is more flexible. It has occupied a certain share in the LED display market and has a tendency to accelerate development. Some solid-state lighting sources have been launched, which will become the medium and long-term development direction of LEDs in the future.
After decades of development, the LED display packaging technology and structure have undergone great changes. The conventional LED package forms mainly include in-line (DIP) LED, surface mount (SMD) LED, piranha LED and PCB. Integrated packaging. Power LEDs are at the heart of future semiconductor lighting.
Leaded package
The LED lead package is a package structure that has been successfully developed and put on the market. Prior to 2002, leaded packages were the primary technology used in LED packaging. Pin-type package is a common package structure, generally used for LEDs with low current (20~30mA) and low power (less than 0.1W). It uses a lead frame as a pin for various package shapes. A typical conventional LED is placed in an envelope that can withstand 0.1W input power. 90% of the heat is dissipated from the negative lead frame to the PCB and then distributed to the air. in.
At present, the design of lead-type LED display screens is relatively mature, with a wide variety and high technical maturity. The structure and reflective layer inside the package are still being improved, which is considered by most customers to be the most convenient and economical in the display industry. Solution, but there are certain problems in attenuation life, optical matching, failure rate, etc., which restricts its development.